AI Solutions

Biscotti

The Biscotti E1.S AI Module uses up to two Hailo-8 Edge AI processors, delivering up to 26 tera-operations per second (TOPS) each for a total of 52 TOPS while consuming as little as 10 watts. Built on an architecture optimized for neural networks, the Hailo-8 processors enable edge devices to run deep learning applications efficiently, effectively, and sustainably. Designed in the E1.S form factor, the module can be inserted directly into standard E1.S SSD slots to instantly add AI acceleration to larger server systems. This enables scalable deployments ranging from parallel neural networks processing large camera arrays to combined configurations supporting large AI workloads such as LLM inference. Compared to GPU modules or traditional add-in cards, the Biscotti E1.S delivers high AI performance with significantly lower power consumption, helping improve data center power efficiency. The module also includes a robust software suite with out-of-the-box support for state-of-the-art deep learning models, along with a comprehensive dataflow compiler that allows developers to quickly and easily port their neural network models.

 

Features

  • E1.S AI Module
  • AI Accelerator: Hailo-8
  • Up to 1600 TOPs of inference performance with air-cooled Dual CPU Servers
  • Inference for Visual Analysis or Generative AI
  • Plug-and-play and hot swappable
  • Easily upgrade from a Biscotti E1.S AI module to the next generation, doubling performance instantly
  • Use 20% of the Watts with TPUs compared to training GPUs
  • 20% of ASP and TCO compared to training GPU servers
  • 12-week lead times, significantly less than the typical for GPU servers
  • Generative AI models with up to 1.8 billion parameters

Specifications

Biscotti AI Module
AI ProcessorDual Hailo-8
Form FactorE1.S (EDSFF)
Power (max)10 Watts
Performance52 TOPS
Interface4 Lane PCIe Gen 3
Supported FrameworksTensorFLow, TensorFlow Lite, ONNX, Keras, Pytorch
Supported OSLinux, windows
CertificationCE, FCC, VCCi, KCC, WEEE
Dimension33.75mm x 118.75mm x 9.5mm (5.9mm w/o Heat Sink Enclosure)
Operating Temperature0°C ~ 70°C
Biscotti Performance (With Atom X6414RE)
Network (AI)Frames per Second (HW)
Resnet_V1_50-Imagenet2692.61
Yolov3_Gluon50
Yolov350.4
Yolov4-leaky56.59
Centerpose_regentx_1.6gf4633.13
Eight Biscotti Module Performance (w/AMD Genoa System)
Network (AI)Frames per Second (HW)
Resnet_V1_50-Imagenet21.5K
Yolov3_Gluon400
Yolov3403.2
Yolov4-leaky452.72
Centerpose_regentx_1.6gf37.1K

Ordering Information

Part NumberNote
UCT201-021-NC Dual AI TPU w/12 lane Switch
UCT201-021-HS Dual AI TPU (9.5mm Heatsink) w/12 lane Switch
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